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Kunshan Kai Gao Electron Technology Limited Company
 
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1.2mm thickiness 8 layer high density board for mobile phone with immersion gold and 1oz Copper

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Title： 1.2mm thickiness 8 layer high density board for mobile phone with immersion gold and 1oz Copper 
Unit price： Negotiable
MOQ： Negotiable
Quantity： Negotiable
Delivery date： Since the payment date Days delivery
Contact： Jasmine Gao （Mr.）    
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1.2mm thickiness 8 layer high density board for mobile phone with immersion gold and 1oz Copper 1.Material: FR-4 2.Copper:1oz
1.2mm thickiness 8 layer high density board for mobile phone with immersion gold and 1oz Copper
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